| 摘要 |
PURPOSE: A thin type circuit board and a method for manufacturing the same are provided to be capable of reducing the size and weight of an electronic apparatus. CONSTITUTION: A thin type circuit board(101) is provided with a thin flexible film part(102), a plurality of metal lines(103) located on the surface of the thin flexible film part, and a plurality of thin type parts(104) located between the metal lines at the upper portion of the thin flexible film part. At this time, the thin type part is electrically connected with the metal line. Preferably, the thickness of the film part is larger than those of the metal line and the thin type part. Preferably, the film part is made of resin or metal. Preferably, the film part is made of one selected from a group consisting of polyethylene terephthalate, polyimide, polyphenylene sulfide, or aluminium. |
