发明名称 METHOD AND DEVICE OF DETECTING END POINT OF ETCHING AND DRY ETCHING SYSTEM
摘要 PROBLEM TO BE SOLVED: To obtain a method of detecting the end point of etching which can detect the end point of etching with good accuracy and a device for the same and a dry etching system having this device. SOLUTION: The method of detecting the end point of etching which detects the end point of etching in removing the thin film on the surface of an object to be treated comprises detecting the light emission intensity of the radiation light released from the entire part of on the surface of the object S to be treated in etching, integrating the light emission intensity signals obtained in the above manner and detecting the end point of etching in accordance with the change in the light emission intensity signals and to integrated value.
申请公布号 JP2003147553(A) 申请公布日期 2003.05.21
申请号 JP20010341961 申请日期 2001.11.07
申请人 SHIBAURA MECHATRONICS CORP 发明人 FURUMITO NORISUKE
分类号 C23F4/00;H01L21/302;H01L21/3065;(IPC1-7):C23F4/00;H01L21/306 主分类号 C23F4/00
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