| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket in which mounting and removal of the IC package can be made easily and steadily. SOLUTION: The IC socket comprises a base body, a seating that has a mounting face of the IC package and is provided on the base body, a cover that is installed on the base body in free upward and downward movement, a contact that contacts electrically with the lead of the IC package mounted on the above seating, and a package guide that is provided at the four corners of the above seating and has faces of which at least all the portions guiding the above IC package incline and of which inclining faces move vertically against the seating in accordance with the vertical movement of the above cover. Further, the above contact moves forward and backward against the IC package mounting face of the seating. The above package guide may be installed integrally with the cover.
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