发明名称 |
Method and apparatus for removing unwanted substance from semiconductor wafer |
摘要 |
An apparatus for removing an unwanted substance from a semiconductor wafer, according to this invention, applies a peeling tape T to a protective tape P on the surface of the semiconductor wafer W. An edge member 28 is placed in contact with the surface of the peeling tape T and run along the protective tape P. The peeling tape T is peeled as being folded back by a large angle of 90 degrees or more at the tip of edge member 28. The protective tape P is peeled and removed along with the peeling tape T from the surface of the wafer. As a result, the unwanted substance is removed with high precision without breaking the wafer W.
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申请公布号 |
US2003092288(A1) |
申请公布日期 |
2003.05.15 |
申请号 |
US20020258792 |
申请日期 |
2002.10.28 |
申请人 |
YAMAMOTO MASAYUKI;AMETANI MINORU |
发明人 |
YAMAMOTO MASAYUKI;AMETANI MINORU |
分类号 |
H01L21/683;H01L21/00;H01L21/304;H01L21/687;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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