发明名称 LASER BEAM MACHINING METHOD AND DEVICE, AND ELECTRONIC DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To perform proper laser-beam machining for securing the stable electric conductivity of a workpiece, e.g. a substrate. SOLUTION: In a method of successively laser-beam machining a workpiece which has a first machining layer and at least a second machining layer that is higher in machining energy than the first layer, the second layer is machined under the first laser condition until its exposed area becomes larger than a prescribed value, and then machined under the second laser condition that is higher in machining energy than the first layer.</p>
申请公布号 JP2003136265(A) 申请公布日期 2003.05.14
申请号 JP20010328804 申请日期 2001.10.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 UKITA KATSUICHI;YOKOHAGI DAISUKE;NARITA TAIJI
分类号 B23K26/00;B23K26/38;B23K101/42;H05K3/00;(IPC1-7):B23K26/00 主分类号 B23K26/00
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