发明名称 |
LASER BEAM MACHINING METHOD AND DEVICE, AND ELECTRONIC DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To perform proper laser-beam machining for securing the stable electric conductivity of a workpiece, e.g. a substrate. SOLUTION: In a method of successively laser-beam machining a workpiece which has a first machining layer and at least a second machining layer that is higher in machining energy than the first layer, the second layer is machined under the first laser condition until its exposed area becomes larger than a prescribed value, and then machined under the second laser condition that is higher in machining energy than the first layer.</p> |
申请公布号 |
JP2003136265(A) |
申请公布日期 |
2003.05.14 |
申请号 |
JP20010328804 |
申请日期 |
2001.10.26 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
UKITA KATSUICHI;YOKOHAGI DAISUKE;NARITA TAIJI |
分类号 |
B23K26/00;B23K26/38;B23K101/42;H05K3/00;(IPC1-7):B23K26/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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