发明名称 |
Bonding head and component mounting apparatus |
摘要 |
There is provided an inclination prevention member for preventing a pressing part from inclining to a supporting part. Therefore a pressing face and a stage face can be arranged to be nearly parallel. The pressing face can be thus disposed with the higher parallelism to the bonding stage as compared with the conventional art, so that components and a circuit form object can be bonded with a high bonding quality.
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申请公布号 |
US6561408(B2) |
申请公布日期 |
2003.05.13 |
申请号 |
US20020043158 |
申请日期 |
2002.01.14 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HOSOTANI NAOTO;ONO SHUJI;NISHIKAWA HIDENOBU;MAENO MITSUO;NASU HIROSHI |
分类号 |
B25J17/02;B23K20/02;H05K3/34;(IPC1-7):B23Q15/00;B23Q16/00;B23K37/00 |
主分类号 |
B25J17/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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