| 摘要 |
PROBLEM TO BE SOLVED: To easily position to a current blocking part buried in an epitaxial wafer for a light emitting diode at the time of forming a surface side electrode of a current constriction type light emitting diode in which the current blocking part is formed on a substrate. SOLUTION: In the current constriction type LED having the current blocking part 2 in a GaAs substrate 1, recessed and projected parts (recessed parts 16 or projected parts) are prepared on the surface of the GaAs substrate 1 in a stage of forming the current blocking part 2, epitaxial layers (3, 4, 5) to be a light emitting part 6 are grown on it, recessed and projected parts (recessed parts 10 or projected parts) are left on a wafer surface as they are, and the surface side electrode 8 and the current blocking part 2 are positioned with the level difference as a mark. |
