| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for treating a substrates capable of quickly and efficiently subjecting the entire surface area of the substrates to a treatment fluid. SOLUTION: In the apparatus for treating the substrates, which comprises a holding means for arranging and holding a plurality of substrates W so as to be spaced in a thickness direction, a driving means for rotating the holding means so as to make the aligned direction of the substrates W the axial direction, and a fluid feeding means 11 for feeding the treatment fluid to the substrates W held by the holding means, the fluid feeding means 11 is constituted so that first feeding ports 13 for diffusing and spraying the treatment fluid L1 in a direction having the components, which are parallel to surfaces of the substrates W held by the holding means, are disposed over the aligned direction of the substrates W and second feeding ports 14 for diffusing and spraying the treatment fluid L2 in a direction perpendicular to the surfaces of the substrates W are disposed over the aligned direction of the substrates W.
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