| 摘要 |
PROBLEM TO BE SOLVED: To provide a package capable of mounting a semiconductor element operating at a high frequency of several tens GHz suitably by improving the high frequency characteristics of the package. SOLUTION: In a package for high frequency element where a basic body 10a for containing a semiconductor element and a cap bonding part 10b are formed integrally of ceramic and a circuit pattern 20 is provided on a plane of the basic body 10a being laid with the cap bonding part 10b while passing through the cap bonding part, the circuit pattern has a pseudo-coaxial structure formed of a metallize layer provided at the cap bonding part and a metallize layer provided on the basic body at the part passing through the cap bonding part, a conductor layer 22 having a structure coplanar with the circuit pattern 20 is provided on the basic body 10a, and a ceramic coat part 30 is provided at a specified width on the surface of the basic body 10a along the inner and outer circumferential edges of the cap bonding part 10b. |
