| 摘要 |
PURPOSE: Equipment for fabricating a semiconductor device is provided to fix a substrate with an ordering pin without damaging the substrate during the test process of the semiconductor device. CONSTITUTION: An ordering pin(110) comprises a supporting part(111), an elastic part(112) and a fixing part(113). The substrate(120) is placed on a chuck(130), when air gap is formed between the substrate and the chuck with the substrate held by the fixing part. After the substrate is fixed by the ordering pin, the substrate is pulled onto the chuck by vacuum pressure until the whole surface of the substrate comes in contact with the chuck surface.
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