| 摘要 |
PROBLEM TO BE SOLVED: To provide a board manufacturing method capable of surely forming a via conductor of a prescribed shape independently of the position of the via conductor on a board requiring the via conductor. SOLUTION: The method for manufacturing a wiring board 1 is provided with an electrolytic Cu plating process for dipping a board 51 having a via hole 19 opened on the surface 53 of the board 51 into an electrolytic Cu plating solution 105, allowing a current to flow into the solution 105, and forming a field via 21 in the via hole 19. In the process, the board 51 is dipped into the solution 105 in an erected state so that the surface 53 is turned to the horizontal direction, bubbles 109 generated lower than the board 51 are allowed to rise from the lower part 53d of the surface 53 to the upper part 53u while touching the surface 53, and bubbling is continued so that the bubbles 109 are allowed to rise up to the upper part of the board 51 to execute electrolytic plating.
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