| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat conductive composition which contains a heat conductive filler at a high ratio, and can produce efficiently a heat conductive forming body which is excellent in heat resistance and does not include bubbles inside; and the heat conductive forming body obtained by using the same. SOLUTION: A heat conductive composition contains an acrylic system polymer, a compound and a heat conductive filler. The acrylic system polymer is obtained by an agglomerative polymerizing method and has a reactive functional group in a molecular chain, and a decrease in weight by heating in 10 min at 150 deg.C under normal pressure is not more than 2%. The compound has two or more functional groups on the average in the molecular chain, having reactivity with a reactive functional group of the acrylic system polymer, and a decrease in weight by heating in 10 min at 100 deg.C under normal pressure is not more than 3%. A forming body is composed of the heat conductive composition.
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