发明名称 Dummy wafers and methods for making the same
摘要 Dummy wafers that are used in IC manufacturing and methods for manufacturing the same are described. The dummy wafers are made with an increased resistance to breaking during CVD manufacturing process. The dummy wafers are made by placing a protective film over the wafer surface(s) exposed during the CVD process. By increasing the resistance to breaking, the protective film extends the useful life of the dummy wafers.
申请公布号 US2003087108(A1) 申请公布日期 2003.05.08
申请号 US20010036291 申请日期 2001.11.07
申请人 HERNER SCOTT BRAD;CLEEVES JAMES M. 发明人 HERNER SCOTT BRAD;CLEEVES JAMES M.
分类号 B32B9/04;H01L21/31;H01L21/469;H01L23/12;(IPC1-7):B32B9/04 主分类号 B32B9/04
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