| 摘要 |
A system and method is disclosed for coating a conventional wafer or a spherical shaped semiconductor substrate with liquid material such as photoresist by utilizing a "drop on demand" piezo driven dispense nozzle, a bubble-jet dispense nozzle, or a continuous piezo jet with charging electrodes. The proposed system and method will greatly reduce, and in some cases virtually eliminate, the waste of photoresist in the process.
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