发明名称 |
Polishing pads and manufacturing methods |
摘要 |
Disclosed is a method of manufacturing polymer materials having properties that are determined by selected process conditions. The properties can be modified for a variety of applications. Exemplary applications are pads for chemical mechanical planarization of substrates and pads for polishing substrates. One embodiment of the method includes the steps of providing a polymer sheet having a substrate contacting area, heating the area a sufficient amount, and applying a sufficient amount of mechanical pressure to the area during at least a portion of the heating step to achieve the desired properties for the material.
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申请公布号 |
US2003083003(A1) |
申请公布日期 |
2003.05.01 |
申请号 |
US20010020081 |
申请日期 |
2001.12.11 |
申请人 |
WEST THOMAS E.;DIETZ DONALD P. |
发明人 |
WEST THOMAS E.;DIETZ DONALD P. |
分类号 |
B24B37/04;B24D11/00;B24D13/14;(IPC1-7):B24B7/22 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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