METHOD FOR SCREEN PRINTING TO SUBSTRATE, METHOD FOR COMPONENT MOUNTING, AND COMPONENT MOUNTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for securing excellent mounting quality without causing any defect such as a short circuit between electrodes 4 of a component even when the pitch between the electrodes 4 becomes narrow. SOLUTION: Screen printing and component mounting are carried out by using a circuit board that has electrodes (4a, 4b) which are parts of a circuit pattern and where the component is mounted and solder resist 5 which is provided around the electrodes and prevents a viscous material 2 such as cream solder from sticking on parts other than the electrodes and becomes an insulating layer, and is characterized in that at least the height of the solder resist between a plurality of electrodes where a plurality of components are mounted is specifically higher than the electrode top surfaces of the substrate.