发明名称 MEMORY ELEMENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a DRAM element and its manufacturing method which provides a sufficient channel length enough to reduce a leak current. SOLUTION: The memory element is composed of a substrate having a plurality of deep trenches arranged in an array, a plurality of deep trench capacitors formed in the deep trenches one to one and having storage electrodes, capacitor dielectrics and capacitor plates, an isolation layer covering the trench capacitors and having first contact holes to form first doping regions, control gates formed above the capacitors, a gate insulation layer covering the sidewalls and tops of the control gates, and a well type silicon layer filling up second contact holes and having second doping regions.
申请公布号 JP2003124344(A) 申请公布日期 2003.04.25
申请号 JP20010307792 申请日期 2001.10.03
申请人 PROMOS TECHNOLOGIES INC 发明人 GO CHOSHAKU
分类号 H01L27/108;H01L21/8242;H01L27/12;H01L29/94 主分类号 H01L27/108
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