| 摘要 |
<p>An improved semi-automatic Pick and Place (SAPP) Machine for assembly of Fine Pitch and Standard Surface Mount Device (SMD) components on Printed Circuit Boards, said machine comprising a high precision X, Y stage sub-assembly, a guide block sub-assembly, X, Y brake assembly, an object oriented user interface software components installed in the computer system, a machine software for the control of said machine embedded in the EPROM of microcontroller subassembly.</p> |
