| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device to prevent the occurrence of vapor condensation to the undersurface of a translucent cover body even when a temperature change occurs to an optical semiconductor, or vapor condensation can dissipate in a short time even when vapor condensation occurs to the under surface of the translucent cover body. SOLUTION: The optical semiconductor is provided with a substrate 2 in the upper main surface of which a recessed part 2a is formed, an optical semiconductor element 3 placed on a bottom 2b of the recessed part 2a and provided at the central part of an upper surface with a light intercepting part 3a, and the translucent cover body 7 joined with the periphery of a recessed part 2a in the upper main surface of the substrate 2 through a resin layer 8 to seal the optical semiconductor element 3. The translucent cover body 7 is provided at the periphery of a portion, opposed to the light intercepting part 3a situated at its under surface, with a heat generating body 9.
|
