| 摘要 |
PROBLEM TO BE SOLVED: To provide a lamination structure of a three-dimensional chip of a module type. SOLUTION: A first chip 11 is disposed on a first receiving plate 1, and the first chip 11 and the first receiving plate 1 are connected so as to obtain electrical continuity by using a bonding method of a chip cover. A second chip 21 is disposed on a bottom surface of the first receiving plate 1, and the second chip 21 and a second receiving plate 2 are connected so as to obtain electrical continuity by using a bonding method of the chip cover. A first flexible circuit board 5 is connected with the insides of the first receiving plate 1 and the second receiving plate 2 by using an anisotropically electrical continuity film or glue 14, 24. As a result, basic constitution is formed. |
