发明名称 ESD protection devices and methods to reduce trigger voltage
摘要 ESD protection devices and methods of forming them are provided in this invention. By employing the thin gate oxide fabricated by a dual gate oxide process and breakdown-enhanced layers, ESD protection devices with a lower trigger voltage are provided. The NMOS structure for ESD protection according to the present invention has islands, a control gate and breakdown-enhanced layers. These islands as well as the breakdown-enhanced layers overlapping the drain region of the NMOS reduce the breakdown voltage of the PN junction in the drain region, thereby reducing the ESD trigger voltage and improving the ESD protection level of the NMOS. Furthermore, the invention is applicable to general integrated-circuit processes as well as various ESD protection devices.
申请公布号 US2003067040(A1) 申请公布日期 2003.04.10
申请号 US20010973291 申请日期 2001.10.08
申请人 WINBOND ELECTRONICS CORP. 发明人 CHEN WEI-FAN;LIN SHI-TRON;CHAO CHUAN-JANE
分类号 H01L23/60;H01L23/62;H01L27/02;H01L29/06;H01L29/74;H01L31/111;(IPC1-7):H01L23/62 主分类号 H01L23/60
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