| 摘要 |
PROBLEM TO BE SOLVED: To provide a hardenable flux and a hardenable flux sheet capable of surely conducting solder joining, not requiring the cleaning/removing of a remaining flux after solder joining, holding the electric insulation property even in a high temperature and high humidity environment, and capable of carrying out high reliability solder joining, in mounting a semiconductor chip and interlayer connection of multilayer interconnection substrate. SOLUTION: In the mounting of the semiconductor chip and the interlayer connection of the multilayer interconnection substrate, the hardenable flux included with a resin (A) provided with a phenolic hydroxy group being of solid state in the room temperature, one or more kinds of resins (B) being a hardener and at least one kind thereof is of liquid state in the room temperature, and a thermoplastic resin (C), is used.
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