TAPE WITH ADHESIVE FOR SEMICONDUCTOR DEVICE AND COPPER- CLAD LAMINATE USING THE SAME, SUBSTRATE FOR CONNECTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a tape with adhesive for a semiconductor, which has a superior wire-bonding property and enables to reduce warp, a copper-clad laminate using the same, and a semiconductor device. SOLUTION: The tape with adhesive for a semiconductor is formed of a laminate which comprises an organic insulation film layer and at least one layer of adhesive layer. The insulation film layer has a film thickness of 10 to 65 μm and a humidity expansion coefficient of 8 ppm/%RH or below, and the adhesive layers have a storage modulus of 50 MPa or above at 150 deg. after curing.