| 摘要 |
<p>A high-frequency module substrate device used for a high-frequency module device. The pass frequency characteristic of a bandpass filter is changed by switching, and a bandpass filter characteristic most suitable in any pass frequency band can be obtained. A thin-film capacitor element (18) is provided between a base substrate (2) composed of core substrates (5, 6) of organic substrates, planarized at the uppermost layer, and having a build-up forming surface (16) and a high-frequency circuit portion (3) formed on the build-up forming surface and fabricated by concentrated constant designing. The load is changed through switching means (4) for a coupler (11) fabricated by distributed constant designing in which the parallel capacitance of a thin-film capacitor is disposed on the base substrate portion side and having a λ/4 frequency characteristic.</p> |
