发明名称 Method of preventing residue contamination of semiconductor devices during furnace processing
摘要 Residue contaminates semiconductor devices during processing in a furnace. Residue contamination is prevented by removing the residue before it builds up to a point where it can contaminate semiconductor devices. Residue build-up is monitored using a residue build-up monitoring device mounted on the furnace exhaust stack. When residue build-up reaches a predetermined level a signal is generated by the residue build-up monitoring device notifying technicians that furnace cleaning is required.
申请公布号 US6536649(B1) 申请公布日期 2003.03.25
申请号 US20000627437 申请日期 2000.07.28
申请人 ADVANCED MICRO DEVICES, INC. 发明人 MASTER RAJ N.;HALDERMAN JONATHAN D.
分类号 H01L21/00;(IPC1-7):B23R37/04;B23R5/00;F27D11/00 主分类号 H01L21/00
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