发明名称 |
Method of preventing residue contamination of semiconductor devices during furnace processing |
摘要 |
Residue contaminates semiconductor devices during processing in a furnace. Residue contamination is prevented by removing the residue before it builds up to a point where it can contaminate semiconductor devices. Residue build-up is monitored using a residue build-up monitoring device mounted on the furnace exhaust stack. When residue build-up reaches a predetermined level a signal is generated by the residue build-up monitoring device notifying technicians that furnace cleaning is required.
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申请公布号 |
US6536649(B1) |
申请公布日期 |
2003.03.25 |
申请号 |
US20000627437 |
申请日期 |
2000.07.28 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
MASTER RAJ N.;HALDERMAN JONATHAN D. |
分类号 |
H01L21/00;(IPC1-7):B23R37/04;B23R5/00;F27D11/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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