发明名称 |
Process for cleaning an integrated circuit package surface, for preparing the same for a subsequent ink marking process, and process for manufacturing an integrated circuit using such a cleaning process |
摘要 |
A process for cleaning an integrated circuit package surface, comprising the steps of introducing the integrated circuit inside a plasma chamber; and of exposing the integrated circuit to a physical plasma obtained starting from a gas consisting of pure argon or any other noble gas having, in the plasma state, the behavior of a halogen, for example helium. The argon pla sma is obtained using the following energization parameters: energization time, 12-13 seconds; energization power, 140-160 W; plasma chamber pressure, 190-210 millitorr; and energization frequency, between 1 kHz and 100 GHz.
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申请公布号 |
US2003051738(A1) |
申请公布日期 |
2003.03.20 |
申请号 |
US20010912435 |
申请日期 |
2001.07.24 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
CIGADA ANDREA;SHECHTER PIERRE YVES;KRITHIVASAN SIVAKUMAR |
分类号 |
B08B7/00;(IPC1-7):B08B7/04 |
主分类号 |
B08B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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