LEADFRAME AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A method for fabricating a leadframe is provided to increase a bonding area and bonding force by roughly processing the surface of the leadframe and performing a soldering process on the rough surface of the leadframe. CONSTITUTION: The leadframe(10) is formed on a sheet metal by striking, including at least one lead group connected to an electronic part. The leadframe is installed in a flat surface of a work table(20). Grinding particles are sprayed at low pressure to sandblast at least one surface of the leadframe. The work table has a fixing unit for fixing the leadframe and the leadframe is so supported by the work table to be bonded to a portion adjacent to the work table.