发明名称 |
Device for detecting an end point of electro-plating and method thereof |
摘要 |
A device for detecting an end point of electro-plating comprises a mandrel having a substrate and a patterned conductive layer with a main conductive area and an insulated conductive area on the substrate, an insulation region interposed between the main conductive area and the insulated conductive area, and a sensor electrically connected to the insulated conductive area for detecting a signal which indicates the end point of electro-plating.
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申请公布号 |
US6533920(B2) |
申请公布日期 |
2003.03.18 |
申请号 |
US20010757129 |
申请日期 |
2001.01.08 |
申请人 |
HEWLETT-PACKARD COMPANY |
发明人 |
NG JOO KHIM JOACHIM;TAN HOCK CHOON |
分类号 |
G01N27/04;G01N27/42;(IPC1-7):G01N27/26;C25D21/12 |
主分类号 |
G01N27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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