| 摘要 |
PROBLEM TO BE SOLVED: To provide a removing liquid for photoresist having excellent anticorrosion property for a metal wiring, particularly Cu wiring, giving no damage on an interlayer film such as a low dielectric layer, organic SOG layer or the like, and having excellent removing property for a photoresist film and the residue after ashing. SOLUTION: The removing liquid for a photoresist contains (a) an acidic compound containing carboxyl groups, (b) at least one kind of basic compound selected from alkanol amines and quaternary ammonium hydroxide expressed by general formula (I), (c) an anticorrosive containing sulfur and (d) water and has 3.5 to 5.5 pH. In formula (I), each of R1 , R2 , R3 and R4 is independently a 1-5C alkyl group or hydroxyalkyl group. |
