| 摘要 |
<p>An electronic package and method of making same in which a circuitized substrate having a first stiffness includes a plurality of electrically conductive circuit members on a first portion of the circuitized substrate and is adapted for having solder connections thereon and for being electrically connected to a semiconductor chip. A stiffener layer having a second stiffness is positioned on a second portion of the circuitized substrate relative to the first portion, the second stiffness of the stiffener layer distributing a portion of the first stiffness of said circuitized substrate so as to substantially prevent failure of the solder connections between the electrically conductive circuit members and the semiconductor chip during operation of the electronic package.</p> |
