| 摘要 |
A plastic ball grid array semiconductor package employs a metal heat spreader (301) having supporting arms (306) embedded in the molding cap, in which the embedded supporting arms (306) are not directly affixed to the substrate (304) or in which any supporting arm (306) that is affixed to the substrate (304) is affixed using a resilient material (302) such as an elastomeric adhesive. A process for forming the package includes steps of placing the heat spreader in a mold cavity, placing the substrate (304) over the mold cavity such that the support surface of the substrate contacts the supporting arms (306) and the heat spreader (301), and injecting the molding material (303) into the cavity to form the molding cap. Also, a process for forming the package includes steps of placing the heat spreader (301) onto the substrate (304) such that at least one of the supporting arms (306) of the heat spreader (301) is affixed to the substrate (304) using a resilient fixative such as an elastomer adhesive, placing a mold cavity over the heat spreader (301), and injecting the molding material (303) into the cavity. |
