| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-clad sheet which can be laminated with a metal foil in relatively loose conditions and enables wide selection of a bonding condition and which can endure the use at a high temperature and besides has excellent thermal conductivity. SOLUTION: A thin-layer polyimide (Y) constituted of an aromatic tetracarboxylic dianhydride residue wherein the molar ratio between a 3,3',4,4'-biphenyl tetracarboxylic dianhydride residue and a 2,3,3',4'-biphenyl tetracarboxylic dianhydride residue is 20 : 80 to 90 : 10 and wherein a pyromellitic dianhydride residue is 0-30 mol%, and of an aromatic diamine residue of a p- phenylenediamine and/or a diaminodiphenyl ether with a 1,3-bis(4-aminophenoxy) benzene contained as a requisite component, is laminated integrally on both sides of a layer of a base polyimide (X) having low thermal expansion properties, so as to form a multilayer polyimide film. The present copper-clad sheet for protection against heat is formed by laminating a copper foil on one side of the multilayer polyimide film and by laminating a metallic or ceramic sheet having the excellent thermal conductivity on the other. |
