| 摘要 |
PURPOSE: An edge ring for a rapid thermal process apparatus is provided to maintain uniformly temperature of a wafer by minimizing a contact area between the wafer and an edge ring. CONSTITUTION: An edge ring(100) includes the first upper side(110), the second upper side(120), and a rib(130). The first upper side(110) is formed on the inside of the edge ring(100). The second upper side(120) is formed on the outside of the edge ring(100). The first upper side(110) is lower than the second upper side(120). The first upper side(110) has an incline plane. The second upper side(120) is connected with the outside of the first upper side(110). The slip of a wafer is prevented by a sidewall for connecting the first upper side(110) with the second upper side(120). The rib(130) is formed at a lower portion of the edge ring(100).
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