摘要 |
The present invention comprises, in the process of forming a through-hole or blind-hole at desired positions of the substrate material, a step of setting a drilling target position for each hole and a plurality of auxiliary drilling positions at a periphery of the drilling target position, and a step a plurality of of drilling at the drilling target position and the plurality of auxiliary drilling positions. Also, in another preferred embodiment of the present invention, it comprises a step of a plurality of drilling only at the auxiliary drilling positions per one hole at the desired position. According to the present invention, through-holes or blind-holes having several sizes of diameters can be formed by using one drilling jig under single drilling condition. Accordingly, it is possible to efficiently produce circuit boards at low costs.
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