发明名称 METHOD AND APPARATUS FOR PRESS MOLDING
摘要 PROBLEM TO BE SOLVED: To solve the problem that in a press for obtaining a final molding by subjecting a primarily molded plate at least made of a resin to secondary molding by pressing it by a mold having a heating means, while the plate is mounted on a heat lower mold, the contact part of the plate is heated to cause the occurrence of warpage in the plate before molding so that its press molding time is elongated, or its molding is disturbed. SOLUTION: The primarily molded plate at least made of a resin is held between heated molds facing each other. Both sides of the plate are brought into contact with the molds respectively and approximately at the same time by moving the plate or the molds, and the plated is subjected to the secondary molding by being press-molded to obtain the final molding.
申请公布号 JP2003062845(A) 申请公布日期 2003.03.05
申请号 JP20010254242 申请日期 2001.08.24
申请人 MEIKI CO LTD 发明人 ASAI IKUO;OGAWA AKIHIKO;KIKUKAWA MASAYUKI
分类号 B29C43/50;B29C43/02;B29C43/04;B29C43/36;B29C43/52;B30B15/34;(IPC1-7):B29C43/04 主分类号 B29C43/50
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