发明名称 TRAY FOR ACCOMMODATING ELECTRONIC COMPONENTS AND METAL MOLD FOR IT
摘要 PROBLEM TO BE SOLVED: To decrease the number of types of trays without increasing plant investment and the number of operation processes, reducing the number of electronic components to be accommodated, and causing no trouble with the work of taking out electronic components by a machine. SOLUTION: Since corner portions of each of first accommodating pockets and corner portions of each of second accommodating pockets overlap each other, sufficient numbers of the first accommodating pockets and the second accommodating pockets can be ensured. For this reason, either of two types of electronic components is selected and sufficient number of the selected type of electronic components can be accommodated in either of the first accommodating pockets or the second accommodating pockets. In addition, since a tray for accommodating two types of electronic components can be molded by using one mold, the number of molds can be reduced. Furthermore, since electronic components are only inserted into an taken out from accommodating pockets, the number of operation processes does not increase, and the work of taking out electronic components by a machine can be carried out without any trouble.
申请公布号 JP2003063587(A) 申请公布日期 2003.03.05
申请号 JP20010254653 申请日期 2001.08.24
申请人 SHARP CORP 发明人 ISHIKAWA KAZUHIRO
分类号 B65D85/86;B29C33/42;B29L31/00;B29L31/36;(IPC1-7):B65D85/86 主分类号 B65D85/86
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