发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE: Provided is a photosensitive resin composition which has excellent abilities such as insulation, smoothness, chemical resistance, and so on, and is easy to form a pattern as an interlayer insulating film. CONSTITUTION: The photosensitive resin composition comprises (A) (i) acrylic copolymer having a weight average molecular weight determined in terms of polystyrene of 5000-20000, in which an area of unreacted monomer of copolymer and polymerization initiator is 5% or less(wherein (i) unsaturated carbonic acid, unsaturated carbonic acid anhydride, or a mixture thereof, (ii) epoxy group containing unsaturated compound, and (iii) olefin-based, unsaturated compound); and (B) 1,2-quinone diazide compound. The resin composition is effective as interlayer insulating film in LCD(liquid crystal device) manufacturing process.
申请公布号 KR20030016505(A) 申请公布日期 2003.03.03
申请号 KR20010050089 申请日期 2001.08.20
申请人 DONGJIN SEMICHEM CO., LTD. 发明人 KWON, GYEONG IL;PARK, SU JEONG
分类号 G03F7/033;C08F216/36;C08L33/02;G03F7/023;G03F7/027;G03F7/038;H01L21/027;(IPC1-7):G03F7/023;G03F7/022 主分类号 G03F7/033
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