发明名称 FLAME SENSOR
摘要 PROBLEM TO BE SOLVED: To provide a flame sensor in which a light-receiving section using a Schottky diode type structure is heat-treated, in advance. SOLUTION: The flame sensor is provided with a semiconductor light- receiving layer and at least a pair of electrodes provided on both sides of the light receiving layer. One of the electrodes and the light-receiving layer constitute a Schottky diode section. At least the Schokky diode section is heat treated at a temperature higher than the upper limit value of the operating temperature of the flame sensor.
申请公布号 JP2003060224(A) 申请公布日期 2003.02.28
申请号 JP20010249184 申请日期 2001.08.20
申请人 OSAKA GAS CO LTD 发明人 HIRANO HIKARI;AMANO HIROSHI;AKASAKI ISAMU;KAMIYAMA SATOSHI
分类号 G01J1/02;H01L29/47;H01L29/872;H01L31/108;(IPC1-7):H01L31/108 主分类号 G01J1/02
代理机构 代理人
主权项
地址