发明名称 ELECTRONIC APPARATUS AND RACK HOUSING THE SAME
摘要 PROBLEM TO BE SOLVED: To improve the heat radiation of a thin type server unit. SOLUTION: Offset flat portions 106, 107 connected with a stepped plane 109 are formed on a back panel 102 of a server unit 101 and the stepped plane 109 has heat-radiating openings 114. By utilizing this plane 109 for forming the radiation openings, heat is effectively radiated from the unit 101, without sacrificing the area for mounting connectors 112, 113, 115, 116, 117.
申请公布号 JP2003060374(A) 申请公布日期 2003.02.28
申请号 JP20010224467 申请日期 2001.07.25
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 ANZAI SEITETSU;MORI SHIGEKI
分类号 H05K7/20;H05K7/18;(IPC1-7):H05K7/20 主分类号 H05K7/20
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