发明名称 BUMPER PACKAGING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a bumper packaging material capable of preventing a bumper surface from being damaged, and easy to peel. SOLUTION: A thin film sheet formed of a mixture of polyethylene and ethylene-1-butene copolymer is used for a sheet-like packaging material (1) to cover and package the entire bumper (5), and the surface of the thin film sheet is finely embossed.
申请公布号 JP2003054620(A) 申请公布日期 2003.02.26
申请号 JP20010248558 申请日期 2001.08.20
申请人 ASAHI KORUKU KOGYO KK 发明人 NAKAMURA KENJI
分类号 B65D81/03;B65D65/02;B65D85/00;(IPC1-7):B65D65/02 主分类号 B65D81/03
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