| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device in which reduction in size and increase in density can be realized and which has high reliability, and to provide a method for manufacturing the same. SOLUTION: The semiconductor device comprises a first semiconductor chip 11 disposed face-down on the surface of a tape substrate 1, and a second semiconductor chip 12 disposed face-up on the rear surface of the first chip. The semiconductor device further comprises a wiring pattern 2 formed on the surface of the tape substrate, a solder bump 3 formed on the rear surface of the tape substrate, the solder ball 1 of the first chip connected to the wiring pattern, a bonding pad formed on the surface of the second chip, a bonding wire 4 connected with the pad and the pattern, and resins 5 formed on the surface of the tape substrate to seal the bonding wire and first and second chips.</p> |
