发明名称 |
Semiconductor chip package with cooling arrangement |
摘要 |
A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.
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申请公布号 |
US2003035270(A1) |
申请公布日期 |
2003.02.20 |
申请号 |
US20010988094 |
申请日期 |
2001.11.19 |
申请人 |
SHIEH WEN-LO;HUANG NING;CHEN HUI-PIN;CHIANG HUA-WEN;CHANG CHUNG-MING;TU FENG-CHANG;HUANG FU-YU;CHANG HSUAN-JUI;HU CHIA-CHIEH;LEU WEN-LONG |
发明人 |
SHIEH WEN-LO;HUANG NING;CHEN HUI-PIN;CHIANG HUA-WEN;CHANG CHUNG-MING;TU FENG-CHANG;HUANG FU-YU;CHANG HSUAN-JUI;HU CHIA-CHIEH;LEU WEN-LONG |
分类号 |
H05K7/20;H01L23/055;H01L23/40;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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