发明名称 |
Method for depositing conductive paste using stencil |
摘要 |
A method for depositing a conductive paste is disclosed. The method comprises aligning apertures in a stencil with conductive regions on a circuit structure, and screening conductive paste into apertures in the stencil. Conductive paste present in the stencil apertures is pushed through the stencil apertures using a pressurized fluid or an array of pin bodies.
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申请公布号 |
US2003035886(A1) |
申请公布日期 |
2003.02.20 |
申请号 |
US20010791265 |
申请日期 |
2001.02.22 |
申请人 |
YAMUNI CHARBEL;LEE MICHAEL G. |
发明人 |
YAMUNI CHARBEL;LEE MICHAEL G. |
分类号 |
B41M1/12;H05K3/12;H05K3/34;(IPC1-7):B05D1/32;B05D5/12 |
主分类号 |
B41M1/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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