发明名称 Electronic device EMC shield with helical spring
摘要 An electronic system enclosure has a first enclosure portion and a second enclosure portion such that the first enclosure portion is removably attachable to the second enclosure portion. A helical spring is mounted to the first enclosure portion and oriented such that the axis of the helical spring substantially follows and contacts the edge of the first enclosure portion, and such that the axis of the helical spring substantially follows and contacts the edge of the second enclosure when the first and second enclosure portions are attached.
申请公布号 US6522538(B1) 申请公布日期 2003.02.18
申请号 US20010800183 申请日期 2001.03.06
申请人 INTEL CORPORATION 发明人 HVIID ERLING
分类号 H05K9/00;(IPC1-7):H05K7/20 主分类号 H05K9/00
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