发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which is ideal for a small-sized semiconductor laser module that can make large-capacity data communication at a high speed by increasing the bit rate and in which an inductor formed in a bias circuit has a large inductance, can be adjusted easily in inductance, and can be minimized in stray capacity. SOLUTION: In this wiring board, a mounting section for a semiconductor laser element 1, an impedance matching circuit for the input signal of the element 1, and the bias circuit which impresses a bias voltage upon the element 1 are formed on the upper surface of an insulating substrate 2 and a second ground electrode 7 is formed on the lower surface of the substrate 2. In the insulating substrate 2, an internal grounding conductor 8a electrically connected to the electrode 7 through grounding through-conductors 8b and an internal inductor pattern layer 8c electrically connected to the bias circuit through through-conductors are provided.
申请公布号 JP2003046179(A) 申请公布日期 2003.02.14
申请号 JP20010226637 申请日期 2001.07.26
申请人 KYOCERA CORP 发明人 INOUE TOMOKI
分类号 H01L23/12;H01S5/022;(IPC1-7):H01S5/022 主分类号 H01L23/12
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