发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component wiring board which is capable of preventing a short circuit from occurring between wiring patterns formed by etching or screen printing. SOLUTION: A circuit pattern is composed of wiring patterns 19 provided in array, a common wire 26 is provided to either of the wiring patterns 19, and the wiring patterns 19 are set independent of each other at a joint between the wiring pattern and the common wire 26. The circuit pattern is formed by etching in a method of manufacturing an electronic component wiring board 10, where a part 19a corresponding to the wiring pattern 19 is provided to a pattern mask 17 used for forming an etching resist film 18 utilized in an etching process, and a corresponding enlarged space 27 which furthermore enlarges a space 25 formed between the wiring patterns 19 is provided to the corner of the pattern mask 17 where a part 26a corresponding to the common wire 26 and a part 19a corresponding to the wiring pattern 19 are connected together.
申请公布号 JP2003046221(A) 申请公布日期 2003.02.14
申请号 JP20010229777 申请日期 2001.07.30
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 HIOKI TOMIO
分类号 B41F15/08;B41F15/36;C23F1/00;C23F1/02;H01L23/12;H05K3/06;H05K3/12;(IPC1-7):H05K3/06 主分类号 B41F15/08
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