| 摘要 |
PROBLEM TO BE SOLVED: To provide such a high security IC label of an interposer type that would be destroyed if someone tries to peel it attached to a target object from the target object. SOLUTION: The IC label is constructed by applying an insulative adhesive B to an area other than a conducting part for connection to an IC chip mounted interposer where a conductive pattern is provided on a substrate. An IC chip is mounted on the conducting part for connection and an adhesive A is applied to the rear surface of the substrate. An antenna holding body is provided where a conductive pattern consisting of an antenna conducting part, and a conducting part for connection is provided on the substrate, and by using the insulative adhesive B, both the IC chip mounted interposer and the antenna holding body are conductively connected. Such adhesive A and the insulative adhesive B, in which the adhesive strength of the adhesive A to the target object is stronger than that of the insulative adhesive B to the interposer and the antenna holding body, are used. |
