| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board manufacturing method capable of manufacturing a wiring circuit board of high quality without changing its dimensions. SOLUTION: This manufacturing method comprises a resin layer forming process of forming an uncured thermosetting resin layer 19 on a wiring circuit board 2; a rolling process of successively rolling circuit boards 2, interposing a right-side spacer 5 and a left-side spacer 7 between the rolled wiring circuit boards 2 at the widthwise ends of the boards 2, interposing an upper spacer 9 between the wiring circuit boards 2 while it is placed on the right-side spacer 5 and the left-side spacer 7 so as to cover the whole wiring circuit board 2 in the widthwise direction, and rolling up the wiring circuit boards 2; and a curing process of heating the rolled wiring circuit boards 2 as they are so as to cure the uncured thermosetting resin layers 19. |
