| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of unestablished manufacturing method for manufacturing high quantity small and thin circuit devices with its circuit elements mounted on a support substrate, such as a ceramic substrate, a flexible sheet. SOLUTION: The circuit device comprising a first plurality of conductive patterns 51 of each mounting section electrically isolated by an isolation groove 61, a thermosetting resin layer 50A for filling the isolation groove 61 and covering the surface of the first conductive patterns 51, a second conductive pattern 71 arranged on the thermosetting resin layer 50A, an insulation resin 50B for covering a circuit element 52 and coupling with the thermosetting resin layer 50A and is capable of improving adhesive strength between the isolation groove 61, and the thermosetting resin layer 50A and the insulation resin 50B, and disposing a multilevel interconnection beneath the circuit element 52 with the first and second conductive patterns 51 and 71, is realized. |
