| 摘要 |
PURPOSE: To provide a semiconductor manufacturing apparatus for achieving a low cost, a small footprint, a small faceprint and high throughput. CONSTITUTION: A load lock chamber 2 and a reactor 1 are directly connected. A semiconductor wafer 12 is carried from the load lock chamber 2 to a susceptor 14 in the reactor 1 by a carrying arm 3 in the load lock chamber 2. A buffer mechanism for temporarily holding the semiconductor wafer 12 in the reactor 1 comprises supporting means 4, 5 disposed around the susceptor 14 for supporting the semiconductor wafer 12 and turning at least in the two horizontal directions, a shaft means 17 for vertically supporting the supporting means 4, 5, a turning mechanism 9 for turning the supporting means 4, 5 coupled to the shaft means 17, and an elevating means 8 for vertically moving the shaft means 17.
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